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Corporate Profile

JX Nippon Mining & Metals Group

Ichinoseki Foil Manufacturing Co., Ltd. 14-39, Higashidai, Ichinoseki-shi, Iwate 021-0822, Japan
TEL:+(81) 191 26 2610
Manufacturing of CAC and others
Kitaibaraki Precision Co., Ltd. 2669-1 Semimoto-naka, Sekimoto-cho, Kitaibaraki-shi, Ibaraki 319-1723, Japan
TEL:+(81) 293 46 6575
Cutting and grinding of metals and metal alloys, etc.
JX Nippon Coil Center Co., Ltd. 3 Kurami, Samukawa-machi, Kouza-gun, Kawagawa 253-0101, Japan
TEL:+(81) 467 75 7005
Processing and delivery of copper, copper alloy and special steel products
JX Nippon Foundry Co., Ltd. 187-4 Usuba, Hanakawa-cho, Kitaibaraki-shi, Ibaraki 319-1535, Japan
TEL:+(81) 293 42 7775
Undertaking of operations at plants
JX Metals Precision Technology Co., Ltd. 10-12 Ueno 1-chome, Taito-ku, Tokyo 110-0005, Japan
TEL:+(81) 3 5812 2721
Manufacture of precision components (produced by precision stamping and/or plating of precision rolled products)
JX Nippon Mining & Metals USA, Inc. 125 North Price Rd., Chandler, Arizona 85224, U.S.A.
TEL:+(1) 480 732 9857
Import, processing and marketing of sputtering targets, and import and sales of compound semiconductor materials
High Performance Copper Foil Inc. 2555 W. Fairview St., Suite #103, Chandler Arizona, U.S.A
Import and marketing of electro-deposited copper foil
Gould Electronics GmbH Hauptstrasse 3, 79356 Eichstetten, Germany
TEL:+(49) 7663 62 103
Manufacturing and marketing of electro-deposited copper foil, CAC and others
JX Nippon Mining & Metals Europe GmbH Kaiserstrasse 7, 60311, Frankfurt am Main, Germany
TEL:+(49) 69 2193653 0
Import and marketing of sputtering targets
JX Nippon Mining & Metals Korea Co., Ltd. 54, Hansan-gil, Cheongbuk-myeon, Pyeongtaek-si, Gyeonggi-do, Korea
TEL:+(82) 31 686 0100
Processing and marketing of sputtering targets for FPDs
Poongsan-Nikko Tin Plating Corp. 611, Daejung-Ri, Onsan-Oup, Ulju-Kun, Ulsan, Korea
TEL:+(82) 52 231 9981
Tin-plating to copper strips, etc.
Nikko Metals Shanghai Co., Ltd. Room No.604~605 Metro Plaza, No.555, LouShanGuan Road, Shanghai, P.R.C.
TEL:+(86) 21 61732312
Processing and marketing of rolled copper, copper alloys and special steel prdoducts, marketing of chemical products and surface treatment agents, recycling business.
Nikko Metals Suzhou Co., Ltd. 536, Fengting Road. Weiting Town, Suzhou Industrial Park, Suzhou, Jiangsu, P.R.C.

TEL:+(86) 512 62752358
Warehousing, processing and marketing of electro-deposited copper foil
Nikko Fuji Precision (Wuxi) Co., Ltd. Wuxi Metal Surface Processing Science & Technology Industrial Park, Luoshe-zhen,
Huishan,Wuxi,Jiangsu, P.R.C.
TEL:+(86) 510 83569918
Manufacturing and marketing of surface-treated materials
Nippon Mining & Metals (Suzhou) Co., Ltd. 536, Fengting Road. Weiting Town, Suzhou Industrial Park, Suzhou, Jiangsu, P.R.C.
TEL:+(86) 512 62750188
Manufacturing and marketing of precision stainless steel products and precision pressing products
Nikko Metals Taiwan Co., Ltd. No.88, Longyuan 1st Rd., Longtan Township, Taoyuan County 32542, Taiwan R.O.C.
TEL:+(886) 3 499 1699
Manufacturing and marketing of electronics materials Slitting operation and marketing of precision rolled products Marketing of chemical products Collection, sorting and sale of materials for recycling
JX Nippon Mining & Metals Philippines, Inc. 117 East Science Ave., Laguna Technopark, Binan, Laguna, Phlippines
TEL:+(63) 49 541 1606
Manufacturing and marketing of electro-deposited and treated rolled copper foils, import and marketing of surface treatment agents
Materials Service Complex Malaysia Sdn. Bhd. Plot D23, Jalan DPB/7, Kawasan Zon Perindustrian Bebas, Pelabuhan Tanjung Pelepas, 81560 Gelang Patah, Johor , Malaysia
TEL:+(60) 7 557 7660
Slitting process for, and sale of, copper and copper alloys, collection, sorting and sale of materials for recycling, Sale of chemical products, electronic parts and others
JX Nippon Mining & Metals Singapore Pte. Ltd. 16 Raffles Quay #33-04 Hong Leong Bldg., Singapore 048581
TEL:+(65) 6225 5413
Import and marketing of electronic materials such as various sputtering targets, compound semiconductor materials, surface treatment agents, electrodeposited & treated rolled copper foils and metal powder