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Thin Film Materials

Sputtering Targets

JX Nippon Mining & Metals is the top global supplier of sputtering targets, thin-film forming materials used for semiconductors, transparent conductive films for flat panel displays (FPDs), and storage media components, among other products.

Compound semiconductor materials

Compound semiconductors, which are formed from two or more elements, exhibit optical and electrical properties superior to those shown by single-element semiconductors, and are used in a wide variety of special-feature electronic devices. JX Nippon Mining & Metals supplies compound semiconductor materials such as InP wafers (used for light-emitting and photo diodes in optical communication systems) and CdTe wafers (used in the infrared sensing devices, radiation detectors and others).

Surface treatment agents, etc

We have developed state-of-the-art surface treatment processes, including a high-speed silver plating process used for lead frames for semiconductor devices, and an electro-less gold plating process for BGA (Ball Grid Array) and CSP (Chip Scale Package). Our proprietary Catalyst Bond process is highly acclaimed by our customers. This process is used in the copper plating pretreatment stages to confer greater reliability on package substrates, which are becoming increasingly high-integration, and to improve production yield and cut costs. Additionally, we have begun full-scale services for the formation of under bump metallurgy (UBM) layers.
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