Electro-deposited Copper Foil
- Electro-deposited Copper Foil
- CAC
We supply high-quality electro-deposited copper foil to meet customers’demands.
We supply HLP foil, which has an extreme degree of flatness on its matte side and achieves extra fine line patterning, and ultra-thin foils in thickness greater than 5μ, in order to satisfy customers’ needs for high-density and fine-patterned PCBs. The ultra-thin foil products can be supplied with or without aluminum carriers. Our diversified product line-up includes, JTCLP foil, which is widely used in package boards for semiconductors, JTCS foil, which can prevent the occurrence of foil cracks thanks to its property of high elongation at elevated temperatures, and TCRR, which is a foil with a thin film resistor, developed to meet the increasing demand for parts-embedded boards.
Electro-deposited Copper Foil
JTC & JTCS Foil
Original & Long Acclaimed Copper Foil
- Our standard electro-deposited copper foil proving its high quality and enjoying a well-deserved reputation in the PWB industry
- Classified into IPC Grade 1 (JTC) and Grade 3 (JTCS)
- Offering excellent mechanical, board and visual properties with stable quality and minimal lead time
- Our unique Cu-Zn treatment Improves thermal and chemical resistances.
JTCLP Foil
JTC Low Profile Copper Foil
- Precisely controlled nodulation on the matte side materializes fine line pattering especially designed for semi-conductor package applications
- Offers two types of nodulation for 12 μm thickness foil
- Our unique Cu-Zn treatment improves thermal and chemical resistances.
RTCS & RTCSHP Foil
Drum Side Treated Copper Foil
- Simplifies multilayer processing to improve yields on inner layers
- Significantly improves etchiability
- Adopting RTCSHP foil further enhances peel strength.
JTCAM Foil
JTC Advanced Metallurgy Copper Foil
- Realizes superior etchability by low profile on the matte side
- Improves handleability by its high tensile strength property
- Maintains stable mechanical properties even after heating process
- Keeping high elongation even under elevated temperature prevents foil cracks from occurring.
HLPLC Foil
Ultra-Low Profile Copper Foil for Semiconductor Package Substrates
- Electro-deposited copper foil with fine nodules on the extremely flattened matte side
- Best suitable for use in semiconductor package substrates thanks to its excellent surface uniformity and etachbility
- Reduces transmission losses even under high frequency bands thanks to its extremely flattened matte side
JTC Heavy Foil
Copper Foil suitable for circuits designed for large current density
- Has a thermal property to realize large current density required for automotive applications and others
- Possesses superior peel strength thanks to its fine and uniform nodule
- Has equivalent properties on the shiny side to conventional foil’s
- Offers foil with up to a maximum of 1296mm
