JX Nippon Metals & Mining exhibited a range of products at the semiconductor industry trade fair SEMICON Taiwan 2011, held at the Taipei World Trade Center on September 7–9.

Over 550 manufacturers of semiconductors and related products from all over the world took part, displaying materials, fabricating devices, components, and applications.

JX Nippon Metals & Mining, together with Nikko Metals Taiwan, exhibited tantalum, copper-manganese alloy, and ultra-high-density tungsten sputtering targets for advanced semiconductor devices; targets for bump formation and through-silicon vias (TSVs), which are used for 3D mounting; and 450 mm diameter polycrystalline silicon wafers for handling tests for next-generation semiconductors.

Our booth attracted many visitors who had lively conversations about the products on display with the staff in attendance.

SEMICON Taiwan 2011 was a great success, drawing a total of over 85,000 visitors in three days, a turnout more than 20 percent higher than last year's.