Asia’s largest exhibition for electronics manufacturing and SMT (surface mount technology), the 41st INTERNEPCON Japan, took place for three days from January 18 to 20 at Tokyo Big Sight (International Exhibition Center). Of the various shows making up INTERNEPCON Japan, the JX Group was represented by JX Nippon Mining & Metals exhibiting products at the 3rd Advanced Electronic Materials Expo Material Japan and by JX Metals Trading along with JX Nippon Mining & Metals at the 13th IC Packaging Technology Expo.

At the Advanced Electronic Materials Expo, we introduced our ultra-thin (6μ) rolled copper foils, electro-deposited and treated rolled copper foils for lithium-ion batteries, and copper foils for ultra-high-density packaging. At the IC Packaging Technology Expo, the technology advantages of the Group were on display in the form of our heat-resistant copper discoloration preventive, silver alloy plating solution for LED use, thick rhodium plating solution and other surface-treatment materials. Each of the products attracted considerable attention and drew numerous inquiries.

During the three days of the exhibition, nearly 40,000 visitors attended from Japan and abroad, helping to make it another highly successful event from start to finish.