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Development of Technologies for electronic materials (1)

From the interconnections of integrated circuits to connectors in PCs and smartphones and in automobiles with their increasing use of electronics, we have created high-functionality metal alloys for a broad range of uses. Various techniques have been devised to achieve high strength along with high conductivity. One is called solutionizing, using high-temperature heat treatment to distribute additive components homogeneously at the atomic level. Another is age-precipitation hardening, using low-temperature heat treatment for high-density distribution of additive elements with particle sizes of a few nanometers. A further significant increase in strength is realized by combining heat treatment with precision rolling. Our quest to develop copper alloys with even more advanced strength and conductivity continues today.

Copper alloy properties