Page Container


Products

Surface Treatment Agents

表面処理剤

Our surface treatment processes enjoy a high reputation among our customers.

We have started "Under Bump Metallurgy (UBM) formation service" using electroless plating process, unique to us. The service can be applied to wafers larger than 4 to 12 inches in diameter and pads made of aluminum alloys, copper, and other materials. Also, the service, leveraging our electroless plating technology, realizes much simpler UBM formation process, in comparison with such conventional methods as electrolytic plating or sputtering. The simplicity stably results in lower production costs and quicker delivery time.

Based on our core competence such as "organic synthesis", "purification technology", "surface treatment technology", "analytical technology" and "mixing and blending skills", we are developing and supplying high quality surface treatment agents. The agents are used in a wide range of electronic components including lead frames, connectors, or printed wiring boards, and highly acclaimed by customers.

Surface Treatment Agents

Anti-epoxy bleed out solution

Anti-epoxy bleed out solution

Anti-Tarnish agent for silver / Seal Treatment for gold

Anti-Tarnish agent for silver / Seal Treatment for gold

Immersion Tin Plating Process

Immersion Tin Plating Process

Anti-tarnish agent for Copper on PWB,with high heat resitance

Anti-tarnish agent for Copper on PWB,with high heat resitance

Imidazole Silane

Imidazole Silane

Sealing Agent for (Ni/) Au on PWB

Sealing Agent for (Ni/) Au on PWB

Anti-tarnish agents for Sn and Sn-alloys

Anti-tarnish agents for Sn and Sn-alloys