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Corson Alloy C7025

C7025 Copper Alloy Designed for High Efficiency Connectors

Description

Data

C7025, developped by Olin, is a high performance Cu-Ni-Si-Mg CORSON alloy. This alloy is widely recognized as a global standard material used for connectors, CPU sockets and semiconductor leadframes. In cooperation with the Olin group, we are providing this alloy.

Table 1. Chemical Composition of C7025 (%)

  Cu Ni Si Mg
Typical Balance 3.0 0.65 0.15

Table 2.Physical Properties of C7025

Electric conductivity 45
(TM04S:48)
%IACS(@20℃)
Specific resistance 38.3 nΩ ・ m(@20℃)
Thermal conductivity 180 W/mK
Thermal expansion coefficient 17.6 ×10-6/K(20 to 300℃)
Young's modulus 131 GPa
Density 8.82 g/cm3

Table 3. Mechanical Properties of C7025 (upper:typical values, lower:standard specs)

Temper Tensile Strength
(MPa)
0.2% offset Yield Strength
(MPa)
Elongatio
(%)
Vickers Hardness
(Hv)
TM02 725
(650-740)
644
(585min)
13
(10.0min)
215
(190-240)
TM03 744
(680-760)
710
(655min)
9
(5.0min)
235
(200-250)
TM04 814
(750-840)
800
(740min)
3
(1.0min)
248
(225-275)
TM04S 785
(710-830)
772
(700min)
3.8
(1.0min)
246
(210-260)
TR02 650
(607-726)
575
(550min)
10
(6.0min)
204
(180-220)