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Electro-deposited Copper Foil

1.5µm-5µm Thickness

Features

  • Various kinds of Thickness and Roughness.
  • Low profile and good peel strength with resin.
  • JXUT is ultra-thin(1.5-5µm) copper foil with 18µm copper carrier.

Typical properties

Type Thickness Peel Strength
(IC Package resin) (FR-4)
µm kN/m kN/m
JXUT-II 5 0.8-0.9 1.2-1.3
JXUT-I 1.5 0.6-0.7 1.1-1.2
2
3
JXUT-III 1.5 0.5-0.6 1.0-1.1
3

Application

  • High-end IC package substrates such as Application Processors for smartphone and tablet

9µm-70µm Thickness

Features

  • Various kinds of Thickness and Roughness.
  • Low profile and good peel strength with resin.
  • Good chemical resistance.

Typical properties

Type Thickness Area weight Tesile strength Elongation Peel Strength
(FR-4)
as Received after Solder
µm g/m2 kg/mm2 % kg/cm kg/cm
JTCLC 9 77 40 4 1.0 0.9
JTCSLC 12 105 40 8 1.2 1.1
18 152 40 12 1.4 1.3
JXLP-III
(JDLC)
12 104 41 6 1.1 1.1
JXEFL-V2 9 76 42 6 0.7 0.6
12 100 42 8 0.8 0.8
18 149 42 14 1.0 0.9
25 230 41 20 1.1 1.1
35 293 40 20 1.3 1.3
45 386 39 22 1.4 1.4
50 434 38 22 1.6 1.6
70 574 36 27 1.7 1.7
JXEFL-III 9 75 42 5 0.6 0.6
12 101 43 8 0.7 0.7
18 150 42 12 0.9 0.9
25 223 41 18 1 1
35 290 40 20 1.1 1.1
45 381 39 22 1.3 1.3
50 434 38 22 1.3 1.3
70 605 37 25 1.6 1.6

Application

  • IC package substrates and HDI(High-density-interconnect) boards

For Coreless board

Overview

We propose two kinds of copper foils and new production method, aiming at improving productivity and yield in coreless board process.

  1. PaCuT
    PaCuTis the application product of cut foil which shiny side of two Cu sheets are attached to each other by glue.
  2. PCS or PCM (Peelable Copper Foil on Shiny side or Matte side)
    PCS or PCM are peelable copper foil with peelable organic material coated on copper surface.
    PCS or PCM can be laminated with resin(e.g. FR-4) by ordinary PCB process and also released easily from the laminated resin at any timing.

Structure

(1)PaCuT

(2)PCS or PCM

Proposal of Coreless board process

Application

  • Coreless PCB, Bendable PCB

Potential applications of PCM

Laminating & Peeling off PCM, roughness of Cu foil is transferred onto resin for adhering other materials

Application proposal of matte replica forming
・for conductive paste
・for Semi additive process
・for facilitating adhesion to hard-to-bond resins