Special Ceramic Powders
Under DevelopmentMicroEncapsulated Phase Change Material (MEPCM)
This technology microencapsulates phase change alloys in an alumina shell.
It is under joint development with Hokkaido University.
Application Examples



Features
- High heat-storage density by using phase-change material (PCM)
- High-temperature thermal storage: above 500℃
- Easy to handle by encapsulation of Al2O3: can be treated as solid material even when core is in liquid state
- High thermal conductivity



Implementation ideas: Making composites with other materials

Property of MEPCM with Al-Si Core*
PCM Core | Al-Si |
---|---|
Melting point | 577[℃] |
Latent heat | 180[J/g] |
Density | 2.71[g/cm3] |
- typical values, not specified yet
Under joint development with Hokkaido University
- Name of invention
- Latent heat storage body, method of manufacturing the latent heat storage body, and heat exchange material
- Application Number:
- Japanese Patent No. 6526630 WO2015/162929A1
(Owner: Hokkaido University)
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