Copper Foil

JXEFL Series Electro-Deposited Copper Foil for Flexible Printed Circuits

Features

  • An annealable copper foil with high-elongation Top class of bendability as electro-deposited copper.
  • Fine nodulation on the smooth surface of the base foil
    Excellent peel strength with the base film despite the low roughness.
  • Various thicknesses
  • BHM or FX surface treatment can be applied for high frequency use.

Applications

  • Flexible printed circuits (FPC)

Typical properties

Product Thickness Tensile strength Elongation
(room temperature)
Peel strength
µm kg/mm2 % kN/m
JXEFL-V2 9 42 6 0.7
12 42 8 0.8
18 42 14 1.0
25 41 20 1.1
35 40 20 1.3
45 39 22 1.4
50 38 22 1.6
70 36 27 1.7
Contact Information
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