JXUT Ultra-Thin Copper Foil with Carrier
- Excellent flatness and low roughness.
- Suitable for ultra-fine line formation in the MSAP process.
- JXUT-I: Ultra-low surface roughness foil well suitable for fine line application
- JXUT-II: Low surface roughness foil with excellent peel strength and chemical resistance
- High Density Interconnect (HDI) boards
- IC package substrates
|Product code||Copper foil thickness||Peel strength|
|(IC package substrate material)||(FR-4)|
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