Copper Foil

JXUT Ultra-Thin Copper Foil with Carrier

Features

  • Excellent flatness and low roughness.
  • Suitable for ultra-fine line formation in the MSAP process.
    • JXUT-I: Ultra-low surface roughness foil well suitable for fine line application
    • JXUT-II: Low surface roughness foil with excellent peel strength and chemical resistance

Applications

  • High Density Interconnect (HDI) boards
  • IC package substrates

Typical properties

Product code Copper foil thickness Peel strength
(IC package substrate material) (FR-4)
µm kN/m kN/m
JXUT-I 1.5 0.6-0.7 1.1-1.2
2
3
JXUT-II 2 0.8-0.9 1.2-1.3
3
5
Contact Information
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