Copper Foil

Treated Rolled Copper Foil

Product Lineup

TPC foil (tough pitch copper foil)

This is our standard rolled copper foil, with good flexibility and vibration resistance properties.

  • It is widely utilized in flexible printed circuits products.
  • Surface treatment is applied to enhance adhesion performance and resistance to heat, acid, and rust.
  • The surface roughness is lower than electro-deposited copper foil.

The properties of HA/HA-V2 foil are dramatically improved compared with ordinary rolled copper foil through adjustments to the grain size and crystallographic orientation.

  • Outstanding flexibility minimizes cracking.
  • Dramatic improvement in vibration resistance.
  • High pliability due to low repulsive force.

HG foil

Recrystallized fine grain for better fine pitch wiring.

  • Excellent circuit linearity and affinity for soft-etching patterning.
  • Excellent handling ability due to high stiffness regardless of the foil's thinness.
  • High elongation property due to homogeneous deformation without constriction, resulting in superior bendability.

Various kinds of surface treatment are available to meet customer's needs.

  • Fine and low roughness treatment achieves better adhesion property to resin.
  • Treatments are highly evaluated related with requirements for high frequency or fine patterning.
  • A variety of rust-proofing treatments achieve outstanding resistance to heat, chemicals, and soldering.

Treated Rolled Copper Foil Lineup and Typical Properties

Treated rolled copper foil lineup

We provide the optimal copper foil to meet all kinds of customer's needs, with a wide range of treated rolled copper foil from 6 µm (under development) to 150 µm.

Foil Products

Grade Type Features Purity Thickness (µm)
150 105 70 35 18 12 9
High functionality HA-V2 (OFC) High flexibility
Low repulsive force
Ease of handling
Cu: At least 99.9%
Ag:100ppm
HA (TPC) High flexibility
Low modulus of elasticity
Cu: At least 99.9%
Ag:190ppm
       
HG (OFC) High flexibility
Circuit linearity
Soft-etching patterning property
Cu: At least 99.9%          
General TPC
(tough pitch copper)
JIS:C1100
General Cu: At least 99.9%      

Typical properties

The flexibility and stability of treated rolled copper foil makes it suitable for FPC products, which requires high reliability.

Physical properties

Type TPC HA HA-V2 HG
IPC Grade Grade 8 (LTA-W)
Modulus of elasticity
(GPa)
(resonance method)
Before annealing 110 125 125 120
After annealing 100
(200℃×30min)
70
(200℃×30min)
75
(200℃×30min)
120
(265℃×30min)
Electrical conductivity (% IACS) 100 100 101 98
Resistivity (ohm-gram/m2) 0.154 0.154 0.153 0.157
  • Properties are shown as typical values, which are not guaranteed values.

Mechanical properties

Type TPC HA HA-V2 HG
IPC Grade Grade 8 (LTA-W)
Tensile strength
(MPa)
Before annealing 440 500 500 550
After annealing 210
(200℃×30min)
145
(200℃×30min)
150
(200℃×30min)
260
(265℃×30min)
Elongation
(%)
Before annealing 1 2 2 2
After annealing 10
(200℃×30min)
8
(200℃×30min)
8
(200℃×30min)
30
(265℃×30min)
  • Properties are shown as typical values, which are not guaranteed values.
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